|
Linux Kernel
3.7.1
|
#include <linux/module.h>#include <linux/kernel.h>#include <linux/slab.h>#include <linux/platform_device.h>#include <linux/platform_data/dwc3-exynos.h>#include <linux/dma-mapping.h>#include <linux/clk.h>#include <linux/usb/otg.h>#include <linux/usb/nop-usb-xceiv.h>#include "core.h"Go to the source code of this file.
Data Structures | |
| struct | dwc3_exynos |
Functions | |
| module_platform_driver (dwc3_exynos_driver) | |
| MODULE_ALIAS ("platform:exynos-dwc3") | |
| MODULE_AUTHOR ("Anton Tikhomirov <[email protected]>") | |
| MODULE_LICENSE ("GPL") | |
| MODULE_DESCRIPTION ("DesignWare USB3 EXYNOS Glue Layer") | |
| MODULE_ALIAS | ( | "platform:exynos-dwc3" | ) |
| MODULE_AUTHOR | ( | "Anton Tikhomirov <[email protected]>" | ) |
| MODULE_DESCRIPTION | ( | "DesignWare USB3 EXYNOS Glue Layer" | ) |
| MODULE_LICENSE | ( | "GPL" | ) |
| module_platform_driver | ( | dwc3_exynos_driver | ) |
1.8.2